The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2014

Filed:

Jan. 26, 2012
Applicants:

Tsutomu Miyahara, Tokyo, JP;

Masahiro Ogushi, Tokyo, JP;

Inventors:

Tsutomu Miyahara, Tokyo, JP;

Masahiro Ogushi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05C 1/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/743 (2013.01); H01L 24/27 (2013.01); H01L 2924/01006 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/743 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01074 (2013.01);
Abstract

According to an embodiment, equipment for manufacturing a semiconductor device includes a first block, a plurality of stamp pins, a second block and a plurality of springs. The first block includes a plurality of first through-holes penetrating from a first major surface to a second major surface. The stamp pins are inserted into each of the first through-holes from the first major surface, each of the stamp pins having an end projected from the second major surface and being capable of moving forward and backward in the insertion direction. The second block has a plurality of second through-holes with an inner diameter larger than an inner diameter of the first through-holes, the second through-holes being disposed so as to overlap with the first through-holes; and the springs are disposed in each of the second through-holes, for biasing the stamp pins in the insertion direction.


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