The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Feb. 29, 2012
Zachary Justin Reitmeier, Lexington, KY (US);
Zachary Justin Reitmeier, Lexington, KY (US);
Funai Electric Co., Ltd., Osaka, JP;
Abstract
A micro-fluid ejection device is assembled by wafer-to-wafer bonding at a temperature below about 150° C. a first silicon oxide layer of a first wafer, having flow features patterned in the first silicon oxide layer on an actuator chip in a first silicon substrate of the first wafer, to a second silicon oxide layer of a second wafer, defining a nozzle plate on a second silicon substrate of the second wafer. Nozzle holes are formed in the nozzle plate in alignment with actuator elements of the actuator chip of the first wafer either before or after bonding the first and second wafers together. The second silicon substrate of the second wafer is used as a handle and then removed from the silicon oxide layer of the second wafer after bonding the first and second wafers together.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile