The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2014
Filed:
Aug. 15, 2013
Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd., Shenzhen, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Shenzhen, CN;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Abstract
A via design method includes doing a simulation according to input data to obtain the impedance of the via of the reference printed circuit board (PCB). An optimal via model is determined according to a group of input data. Simulating is performed according to the thickness of a PCB to-be-designed and the optimal via model data, to obtain the impedance of a via of a PCB to be designed. The number of the anti-pads of the via of the PCB to be designed is recorded when the difference between the impedance of the via of the PCB to be designed and the impedance of the via model of the reference PCB does not fall within a preset range. An interval between each two adjacent anti-pads of the via of the PCB to designed is determined according to the recorded number and the thickness of the PCB to be designed.