The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2014
Filed:
Apr. 26, 2012
Applicants:
Jun Ishii, Ibaraki, JP;
Daisuke Yamauchi, Ibaraki, JP;
Inventors:
Jun Ishii, Ibaraki, JP;
Daisuke Yamauchi, Ibaraki, JP;
Assignee:
Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/00 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract
An insulating layer is formed on a support substrate having a conductive property. Write wiring traces, read wiring traces, and first and second electrode pad pairs are formed on the insulating layer. The first electrode pad pair is connected to the write wiring traces. The second electrode pad pair is connected to the read wiring traces. Parts of regions of the support substrate, which overlap the electrode pads, are removed. Thus, openings are formed in the regions of the support substrate, which overlap the electrode pads.