The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2014
Filed:
Feb. 14, 2007
Minoru Isshiki, Chiba, JP;
Tomoko Kato, Ichihara, JP;
Yoshitsugu Morita, Ichihara, JP;
Hiroshi Ueki, Ichihara, JP;
Minoru Isshiki, Chiba, JP;
Tomoko Kato, Ichihara, JP;
Yoshitsugu Morita, Ichihara, JP;
Hiroshi Ueki, Ichihara, JP;
Dow Corning Toray Company, Ltd., Chiyoda-Ku, Tokyo, JP;
Abstract
A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching.