The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2014
Filed:
Oct. 29, 2009
Rong-chang Liang, Cupertino, CA (US);
Jerry Chung, Mountain View, CA (US);
Chinjen Tseng, Freemont, CA (US);
Shuji Rokutanda, Fremont, CA (US);
Yuhao Sun, Newark, CA (US);
Hsiao-ken Chuang, Sunnyvale, CA (US);
Rong-Chang Liang, Cupertino, CA (US);
Jerry Chung, Mountain View, CA (US);
Chinjen Tseng, Freemont, CA (US);
Shuji Rokutanda, Fremont, CA (US);
Yuhao Sun, Newark, CA (US);
Hsiao-Ken Chuang, Sunnyvale, CA (US);
Trillion Science, Inc., Fremont, CA (US);
Abstract
Structures and manufacturing processes of an ACF array using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, or selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. Cavities in the array, and particles filling the cavities, can have a unimodal, bimodal, or multimodal distribution.