The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2014
Filed:
Jul. 29, 2009
Applicants:
Daniel Y. Chu, Hercules, CA (US);
Hui Du, San Ramon, CA (US);
Inventors:
Daniel Y. Chu, Hercules, CA (US);
Hui Du, San Ramon, CA (US);
Assignee:
Bio-Rad Laboratories, Inc., Hercules, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 51/10 (2006.01); B29C 51/04 (2006.01); B01L 3/00 (2006.01); B29C 51/02 (2006.01); B29K 23/00 (2006.01);
U.S. Cl.
CPC ...
B29C 51/04 (2013.01); B29C 51/02 (2013.01); B01L 2200/12 (2013.01); B01L 3/50851 (2013.01); B01L 2300/0829 (2013.01); B29K 2023/06 (2013.01); B29C 2791/006 (2013.01); B29K 2023/12 (2013.01);
Abstract
A multi-well plate with wells having ultra-thin walls and yet with sufficient structural rigidity to allow reliable use of the plate in automated instrumentation is formed by first forming a plate blank by injection molding, the blank being of a thickness that provides the desired rigidity, and then subjecting the blank to vacuum forming to stretch designated areas in the blank to form wells or to extend wells already formed, the stretching resulting in a reduction in thickness of the molded resin at the walls of the wells only.