The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2014
Filed:
Aug. 07, 2012
Takeshi Matsui, Tokyo, JP;
Nobuhiro Kihara, Kanagawa, JP;
Junichi Kuzusako, Saitama, JP;
Sony Corporation, Tokyo, JP;
Abstract
Disclosed is a method of manufacturing a molded object. The method includes: supplying a first liquid material to a first region out of a molding enabling region where a powder material is arranged and curing the powder material of the first region using a lamination molding technology to form a first insoluble part insoluble in a solvent; supplying a second liquid material different from the first liquid material to the powder material of a second region, which is provided so as to be surrounded by the first region, out of the molding enabling region and curing the powder material of the second region using the lamination molding technology to form a second soluble part soluble in the solvent; and dissolving the second part in the solvent.