The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2014
Filed:
Jun. 08, 2011
Emmanuel Scorsone, Magny-les-Hameaux, FR;
Philippe Bergonzo, Massy, FR;
Gaelle Lissorgues, Le Perreux sur Marne, FR;
Lionel Rousseau, Le Perreux sur Marne, FR;
Michel Bonnauron, Avignon, FR;
Christine Alice Regine Helene Terrades, Avignon, FR;
Serge Anne Daniel Bonnauron, Avignon, FR;
Lucas Claude Jean Francois Bonnauron, Avignon, FR;
Tanguy Richard Yves Bonnauron, Avignon, FR;
Emmanuel Scorsone, Magny-les-Hameaux, FR;
Philippe Bergonzo, Massy, FR;
Mathias Bonnauron, Gif sur Yvette Cedex, FR;
Gaelle Lissorgues, Le Perreux sur Marne, FR;
Lionel Rousseau, Le Perreux sur Marne, FR;
Commissariat a l'energie atomique et aux energies alternatives, Paris, FR;
Chambre de Commerce et d'Industrie de Paris (ESIEE Paris), Noisy le Grand, FR;
Abstract
A method for manufacturing an intraocular retinal implant including: providing a mold capable of supporting growth of a layer of doped diamond, the mold including, on one face, elements all depressed or all projecting with respect to the surface of the face, and constituting a pattern cavity for the electrodes of the implant which it is desired to obtain; producing the doped diamond electrodes by growing a layer of doped diamond in all or part of a space occupied by the pattern cavity elements; forming a first insulating layer on the face of the mold including the pattern cavity; producing interconnection lines by depositing an electrically conductive material at least in spaces not covered by the first insulating layer; forming a second insulating layer on the mold face including the pattern cavity, the second layer covering the interconnection lines, the first and second insulating layers forming a flexible plate of the implant; removing the mold.