The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 2014
Filed:
Feb. 04, 2011
Jun Qi, Cupertino, CA (US);
Wayne H. Fu, Mountain View, CA (US);
Chenhui Wang, Cupertino, CA (US);
Kuanying Lin, Mountain View, CA (US);
Nathan K. Gupta, San Francisco, CA (US);
Victor H. Yin, Cupertino, CA (US);
Silvio Grespan, Shanghai, CN;
Jun Qi, Cupertino, CA (US);
Wayne H. Fu, Mountain View, CA (US);
Chenhui Wang, Cupertino, CA (US);
Kuanying Lin, Mountain View, CA (US);
Nathan K. Gupta, San Francisco, CA (US);
Victor H. Yin, Cupertino, CA (US);
Silvio Grespan, Shanghai, CN;
Apple Inc., Cupertino, CA (US);
Abstract
Structures such as display structures and other electronic device structures may be shaped using water jet cutting equipment. The water jet cutting equipment may be used to produce a water jet. The water jet may be used to cut layer of material such as display layers and other structures. Water jet cutting may form edge cuts, cuts for openings in the structures, chamfers, and other features. Multiple layers may be simultaneously cut using water jet cutting. Positioning equipment may be used to control the position of a workpiece relative to a water jet nozzle. The positioning equipment may be controlled using a control unit. During water jet cutting operations, the workpiece may be trimmed, openings may be formed, and features such as chamfers may be created. A workpiece may include a cover glass, a color filter array, a thin-film transistor layer, and other display layers and device structures.