The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2014

Filed:

Oct. 28, 2013
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Takayuki Yao, Nagaokakyo, JP;

Assignee:

Murata Manufacturing Co., Ltd., Nagaokakyo-Shi, Kyoto-fu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/06 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/1227 (2013.01); H01G 4/1218 (2013.01); H01G 4/1245 (2013.01); H01G 4/30 (2013.01);
Abstract

Provided is a laminated ceramic capacitor that can suppress the decrease in insulation resistance after a moisture-resistance loading test. It contains ceramic layers which include: main-phase grains that have a perovskite-type compound containing Ba and Ti and optionally containing Ca, Sr, Zr, and Hf; and secondary-phase grains that have an average grain size of 100 nm or more and have a Si content of 50 mol % or more per grain, the average grain boundary number, represented by (Average Thickness for Ceramic Layers)/(Average Grain Size for Main Phase Grains)−1, is greater than 0 and 3.0 or less, and the average grain size for the secondary-phase grains is ¼ or more of the average thickness for the ceramic layers


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