The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2014
Filed:
Dec. 08, 2009
Seiichi Matsumoto, Nagaokakyo, JP;
Toshiyuki Iwanaga, Sabae, JP;
Makoto Ogawa, Fukui, JP;
Akihiro Motoki, Fukui, JP;
Seiichi Matsumoto, Nagaokakyo, JP;
Toshiyuki Iwanaga, Sabae, JP;
Makoto Ogawa, Fukui, JP;
Akihiro Motoki, Fukui, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A region where a plating film constituting an external electrode is formed can be accurately controlled in an electronic component in which the external electrode is formed by directly plating a particular region in a surface of a component body. In a component body, a bump is provided in a position in which a region where an external electrode should be formed is partitioned. In a plating process, growth of the plating film constituting the external electrode is substantially stopped or delayed in the bump. As a result, a termination point of the growth of the plating film constituting the external electrode can be accurately controlled in the position of the bump.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile