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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8797054 B1

PDFFull Text
Expired
Date of Patent:
Aug. 05, 2014

Filed:

Aug. 03, 2011

Thermal and stress gradient based rc extraction, timing and power analysis

Applicants:

Hongmei Liao, San Diego, CA (US);

Riko Radojcic, San Diego, CA (US);

Inventors:

Hongmei Liao, San Diego, CA (US);

Riko Radojcic, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorneys:

Sam Talpalatsky

Nicholas J. Pauley

Joseph Agusta

Primary Examiner:

Melissa Koval

Assistant Examiner:

Stephen G Armstrong

Int. Cl.
CPC ...
G01R 31/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Timing, power and SPICE analysis are performed on a circuit layout, based on temperature and stress variations or gradient across the circuit layout. Specifically, the temperature and stress values of individual window locations across the layout are used to obtain temperature and stress variation aware resistance/capacitance (RC), timing, leakage and power values. In addition, in 3D integrated circuits (IC), the stress and thermal variations or gradients of one die may be imported to another die located on a different tier.

Find Patent Forward Citations

Liao, Hongmei. (2014). Thermal and stress gradient based rc extraction, timing and power analysis (U.S. Patent No. 8797054). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8797054

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