The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2014
Filed:
Sep. 01, 2010
Shuji Tanaka, Miyagi, JP;
Masayoshi Esashi, Miyagi, JP;
Sakae Matsuzaki, Miyagi, JP;
Mamoru Mori, Ishikawa, JP;
Shuji Tanaka, Miyagi, JP;
Masayoshi Esashi, Miyagi, JP;
Sakae Matsuzaki, Miyagi, JP;
Mamoru Mori, Ishikawa, JP;
Tohoku University, Sendai-shi, Miyagi, JP;
Abstract
By forming a metal layeron at least one of a connecting electrodeof a first substrateand a connecting electrodeof a second substrate, placing the first substrateand the second substratetogether in order that the connecting electrodeand the connecting electrodeface opposite to each other via the metal layer, increasing temperature up to anodic bonding temperature, and applying DC voltage between the first substrateand the second substratewhile maintaining that temperature, the first substrateand the second substrateare anodically bonded, and at the same time by melting the metal layer, the connecting electrodeand the connecting electrodeare electrically connected. The method achieves anodic bonding of substrates with high yield and at the same time establishes wiring connection, effective for packaging.