The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2014
Filed:
Aug. 12, 2010
Applicants:
Dubravko I. Babic, Santa Clara, CA (US);
Quentin E. Diduck, Ithaca, NY (US);
Alex Schreiber, Campbell, CA (US);
Inventors:
Dubravko I. Babic, Santa Clara, CA (US);
Quentin E. Diduck, Ithaca, NY (US);
Alex Schreiber, Campbell, CA (US);
Assignee:
Element Six Technologies US Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
High-power and high-frequency semiconductor devices require high signal integrity and high thermal conductance assembly technologies and packages. In particular, wide-gap-semiconductor devices on diamond benefit from spatially separate electrical and thermal connections. This application discloses assembly and package architectures that offer high signal integrity and high thermal conductance.