The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2014
Filed:
Jun. 13, 2012
Applicant:
Kyung Ho Shin, Gwangju, KR;
Inventor:
Kyung Ho Shin, Gwangju, KR;
Assignee:
LG Innotek Co., Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 33/64 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/642 (2013.01); H01L 33/486 (2013.01); H01L 33/60 (2013.01); H01L 33/64 (2013.01); H01L 33/644 (2013.01); H01L 2924/00014 (2013.01);
Abstract
An LED package is provided. The LED package comprises a metal plate, circuit patterns, and an LED. The metal plate comprises grooves. The insulating layer is formed on the metal plate. The circuit patterns are formed on the insulating layer. The LED is electrically connected with the circuit pattern on the insulating layer.
Shin, Kyung. (2014). Light-emitting diode package and manufacturing method thereof (U.S. Patent No. 8796717). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8796717
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile