The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2014
Filed:
Nov. 18, 2008
Min-ill Kim, Cheonan-si, KR;
Jong-gi Lee, Yongin-si, KR;
Kwang-yong Lee, Anyang-si, KR;
Ki-kwon Jeong, Cheonan-si, KR;
Min-Ill Kim, Cheonan-si, KR;
Jong-Gi Lee, Yongin-si, KR;
Kwang-Yong Lee, Anyang-si, KR;
Ki-Kwon Jeong, Cheonan-si, KR;
SAMSUNG Electronics Co., Ltd., Suwon-si, KR;
Abstract
An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received in a magazine so as to be vertically stacked and a plurality of magazines each having one or more processing objects is stored in an input stacker. The heating unit performs a reflow process on the processing objects in the magazine stored in the input stacker by an induction heating method. A processing object that a reflow process is completed is received in a magazine and then stored in an output stacker.