The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2014
Filed:
Jan. 29, 2010
Applicants:
Ukyo Ikeda, Fujisawa, JP;
Masato Nakamura, Fujisawa, JP;
Shiro Yamashita, Yokohama, JP;
Inventors:
Assignee:
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01); H05K 1/03 (2006.01); H05K 1/16 (2006.01); H05K 1/11 (2006.01); H01L 23/48 (2006.01); H01L 29/40 (2006.01); H05K 7/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
In ultrasonic bonding of a metal terminal to a substrate pad, a thin buffer metal layer which is formed of a soft metal or a highly slidable metal is interposed between a terminal edge and a pad so as to prevent direct contact between an end of the terminal and the pad upon bonding. This makes it possible to prevent abrasion and a crack in the pad at the end of the terminal caused by pressure and an ultrasonic wave upon the ultrasonic bonding. This makes it possible to realize a compact bonded structure with high reliability.