The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2014
Filed:
Oct. 05, 2012
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventor:
Shoichi Osada, Annaka, JP;
Assignee:
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/22 (2006.01); B32B 15/08 (2006.01); C08K 7/14 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
B32B 15/08 (2013.01); C08K 3/22 (2013.01); C08K 7/14 (2013.01); C08L 63/00 (2013.01);
Abstract
A prepreg that yields a semiconductor device which, even when using Cu wire, exhibits excellent reliability under conditions of high temperature and high humidity (heat-resistant and moisture-resistant reliability), a metal-clad laminate and a printed wiring board that use the prepreg, and a semiconductor device that uses the printed wiring board. Specifically disclosed are a prepreg comprising a substrate and a B-staged resin composition comprising (a) a thermosetting resin, (b) a hydrotalcite compound having a specific composition, (c) zinc molybdate, and (d) lanthanum oxide.