The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2014

Filed:

Apr. 05, 2012
Applicants:

Jörg Erich Sorg, Regensburg, DE;

Stefan Gruber, Bad Abbach, DE;

Siegfried Herrmann, Neukirchen, DE;

Berthold Hahn, Hemau, DE;

Inventors:

Jörg Erich Sorg, Regensburg, DE;

Stefan Gruber, Bad Abbach, DE;

Siegfried Herrmann, Neukirchen, DE;

Berthold Hahn, Hemau, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 24/24 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01015 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01038 (2013.01); H01L 33/508 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01058 (2013.01); H01L 2224/76155 (2013.01); H01L 2924/01105 (2013.01); H01L 2429/01005 (2013.01); H01L 2924/01082 (2013.01); H01L 2224/82039 (2013.01); H01L 33/0079 (2013.01); H01L 24/82 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01029 (2013.01); H01L 33/62 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01047 (2013.01); H01L 2224/24226 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01079 (2013.01);
Abstract

A light-emitting diode arrangement comprising a plurality of semiconductor chips which are provided for emitting electromagnetic radiation from their front side and which are fixed by their rear side—opposite the front side—on a first main face of a common carrier body, wherein the semiconductor chips consist of a respective substrateless semiconductor layer stack and are fixed to the common carrier body without an auxiliary carrier, and to a method for producing such a light-emitting diode arrangement.


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