The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2014
Filed:
Mar. 17, 2010
Hidetoshi Kami, Shizuoka, JP;
Junichi Yamazaki, Shizuoka, JP;
Yukio Fujiwara, Shizuoka, JP;
Kazuhiro Egawa, Shizuoka, JP;
Hidetoshi Kami, Shizuoka, JP;
Junichi Yamazaki, Shizuoka, JP;
Yukio Fujiwara, Shizuoka, JP;
Kazuhiro Egawa, Shizuoka, JP;
Ricoh Company, Ltd., Tokyo, JP;
Abstract
An electrophotographic photoconductor having a photosensitive layer and a crosslinked resin surface layer over a support, wherein shapes of concaves and convexes in a surface of the electrophotographic photoconductor are measured by a surface roughness/profile measuring device to obtain one-dimensional data arrays, the arrays are subjected to multiresolution analysis (MRA-1) through wavelet transformation to be separated into six frequency components including HHH, HHL, HMH, HML, HLH and HLL to obtain one-dimensional data arrays, the arrays of the HHL are thinned out to be reduced 1/10 to 1/100, thereby producing one-dimensional data arrays, which are then subjected to multiresolution analysis (MRA-2) through wavelet transformation to be separated into six frequency components including LHH, LHL, LMH, LML, LLH and LLL to thereby obtain 12 frequency components in total; and a center-line average roughness (WRa) of the 12 frequency components satisfies relationship (i) below.1−597×WRa(HML)+238×WRa(HLH)−95×WRa(LHL)+84×WRa(LMH)−79×WRa(LML)+55×WRa(LLH)−17×WRa(LLL)>0  (i)