The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2014

Filed:

Mar. 27, 2012
Applicants:

Michio Shimamoto, Osaka, JP;

Shota Matsuda, Osaka, JP;

Sinyul Yang, Osaka, JP;

Inventors:

Michio Shimamoto, Osaka, JP;

Shota Matsuda, Osaka, JP;

Sinyul Yang, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 17/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is an interlayer for laminated glass which increases sound-insulating properties in a high frequency area in a laminate glass over a wide temperature range. An interlayer film for laminated glass of the present invention includes first, second, and third layers, wherein when a cloud point C1 is measured by using a first liquid containing 100 parts by weight of a first plasticizer and 8 parts by weight of a first polyvinyl acetal resin contained in the first layer, a cloud point C2 is measured by using a second liquid containing 100 parts by weight of a second plasticizer and 8 parts by weight of a second polyvinyl acetal resin contained in the second layer, and a cloud point C3 is measured by using a third liquid containing 100 parts by weight of a third plasticizer and 8 parts by weight of a third polyvinyl acetal resin contained in the third layer, the cloud point C1 is 10° C. or lower; the cloud point C2 is higher than the cloud point C1 by at least 5° C.; and the cloud point C3 is higher than the cloud point C1 by at least 50° C. and higher than the cloud point C2.


Find Patent Forward Citations

Loading…