The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2014

Filed:

Jul. 11, 2006
Applicants:

Hermann Bichler, Rohrbach, DE;

Reinhard Hanzlik, Freising, DE;

Stefan Fries, Landshut, DE;

Frank Mueller, Freising, DE;

Heinrich Wachinger, Helfenbrunn, DE;

Inventors:

Hermann Bichler, Rohrbach, DE;

Reinhard Hanzlik, Freising, DE;

Stefan Fries, Landshut, DE;

Frank Mueller, Freising, DE;

Heinrich Wachinger, Helfenbrunn, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/50 (2006.01); C23C 16/458 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
C23C 14/50 (2013.01); C23C 16/4585 (2013.01); H01L 21/68721 (2013.01); H01L 21/68728 (2013.01);
Abstract

A wafer clamp assembly for holding a wafer during a deposition process comprises an outer annular member defining a central recess that has a diameter slightly greater than the diameter of the wafer. A plurality of finger members are carried by the outer annular member and extend radially inwardly from the outer annular member into the central recess, wherein each of the finger members has a free end for contacting the wafer during the deposition process.


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