The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2014
Filed:
Nov. 21, 2007
Sadayuki Yoneshima, Hirakata, JP;
Masayuki Sakai, Osaka, JP;
Hisao Aota, Nara, JP;
Hiroshi Watanabe, Higashiosaka, JP;
Mitsuaki Samejima, Sakai, JP;
Yumiko Omiya, Moriguchi, JP;
Sadayuki Yoneshima, Hirakata, JP;
Masayuki Sakai, Osaka, JP;
Hisao Aota, Nara, JP;
Hiroshi Watanabe, Higashiosaka, JP;
Mitsuaki Samejima, Sakai, JP;
Yumiko Omiya, Moriguchi, JP;
Tanazawa Hallosha Co., Ltd., Osaka, JP;
Abstract
An object of the present invention is to provide a mold for resin molding which ensures ventilation characteristic without requiring an enormous amount of work. The mold for resin molding of the present invention includes: a mold; a design layerformed inside the mold; and a air permeable interposing layerfor forming the design layeron an inner surface of the mold. The moldforms a ventilating throughhole. The design layeris made of a resin having projections and depressions on the surface, and has a ventilating throughholeformed so as to couple to the ventilating throughhole. The air permeable interposing layeris arranged next to the inner surface of the moldso that an inner surface of the design layer, the ventilating throughholeof the design layer, and the ventilating throughholeof the moldcouple to each other.