The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2014

Filed:

Oct. 11, 2011
Applicants:

Alton H. Phillips, East Palo Alto, CA (US);

Akio Ohta, Saitama, JP;

Douglas C. Watson, Campbell, CA (US);

Inventors:

Alton H. Phillips, East Palo Alto, CA (US);

Akio Ohta, Saitama, JP;

Douglas C. Watson, Campbell, CA (US);

Assignee:

Nikon Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 21/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to one aspect of the present invention, an apparatus includes a surface and a first array. The surface emits radiation, and the first array is arranged over the surface and arranged to provide cooling to the surface, the first array including a plurality of TECs. At least a first sensing arrangement is substantially integrated with the first array, wherein the first sensing arrangement is arranged to make a non-contact measurement associated with the surface. The apparatus also includes a controller arranged to obtain the non-contact measurement and to use the non-contact measurement to control the cooling provided by the first array.


Find Patent Forward Citations

Phillips, Alton. (2014). Method and apparatus for utilizing in-situ measurements techniques in conjunction with thermoelectric chips (tecs) (U.S. Patent No. 8794011). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8794011

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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