The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2014
Filed:
Dec. 19, 2011
Po-yuan Hsu, New Taipei, TW;
Wei-cheng Wang, New Taipei, TW;
Chen-yu LI, New Taipei, TW;
Hsing-wang Chang, New Taipei, TW;
Tsung-hsien Chen, New Taipei, TW;
Chia-cheng Su, New Taipei, TW;
Po-Yuan Hsu, New Taipei, TW;
Wei-Cheng Wang, New Taipei, TW;
Chen-Yu Li, New Taipei, TW;
Hsing-Wang Chang, New Taipei, TW;
Tsung-Hsien Chen, New Taipei, TW;
Chia-Cheng Su, New Taipei, TW;
Wistron Corporation, New Taipei, TW;
Abstract
An assembly includes an electronic device casing, a heat-dissipating module and a waterproofing module. The electronic device casing is formed with an encircling wall. The encircling wall has a wall body and an apertured portion formed in the wall body. The heat-dissipating module is coupled to the electronic device casing, is surrounded by the encircling wall, and includes a heat pipe extending through the apertured portion. The waterproofing module includes a waterproofing element that has a ring portion disposed on a top rim of the wall body, and a sleeve portion having a first sleeve segment that is connected to the ring portion, that is sleeved on the heat pipe and that engages the apertured portion so as to establish water tightness between the heat pipe and the apertured portion.