The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2014
Filed:
Oct. 25, 2011
Jin Suk Son, Gyunggi-do, KR;
Kwang Soo Kim, Gyunggi-do, KR;
Young Ki Lee, Gyunggi-do, KR;
Sun Woo Yun, Gyunggi-do, KR;
Sung Keun Park, Gyunggi-do, KR;
Jin Suk Son, Gyunggi-do, KR;
Kwang Soo Kim, Gyunggi-do, KR;
Young Ki Lee, Gyunggi-do, KR;
Sun Woo Yun, Gyunggi-do, KR;
Sung Keun Park, Gyunggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;
Abstract
Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate made of a metal material; cooling channels formed to allow a cooling material to flow in an inner portion of the base substrate; an anodized layer formed on an outer surface of the base substrate; a metal layer formed on a first surface of the base substrate having the anodized layer and including circuits and connection pads; and semiconductor devices mounted on the metal layer.