The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2014
Filed:
Apr. 07, 2010
Tougo Teramoto, Wakayama, JP;
Shigeru Hosoe, Hino, JP;
Akira Sato, Hachioji, JP;
Toshiyuki Imai, Hachioji, JP;
Yuiti Fujii, Hachioji, JP;
Tougo Teramoto, Wakayama, JP;
Shigeru Hosoe, Hino, JP;
Akira Sato, Hachioji, JP;
Toshiyuki Imai, Hachioji, JP;
Yuiti Fujii, Hachioji, JP;
Konica Minolta Opto, Inc., Tokyo, JP;
Abstract
Provided are a wafer lens production method, an intermediate die, an optical component, a molding die, and a molding die production method. The production method of a wafer lens () includes a first intermediate die production step using a die (), a second intermediate die production step using the first intermediate die (), and a wafer lens production step using the second intermediate die (). A first intermediate-die substrate () is provided with a depressed section () on the surface facing the die (). When photo-curable resin (A) is pressed, at least a portion closer to the first intermediate-die substrate () among the top () and the peripheral section () of the die () is arranged in the depressed section (), and a gap is provided so that the die () does not contact with a depressed plane () of the depressed section ().