The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2014

Filed:

Oct. 29, 2010
Applicants:

Byungwook Min, San Antonio, TX (US);

Der-woei Wu, Fremont, CA (US);

Inventors:

ByungWook Min, San Antonio, TX (US);

Der-Woei Wu, Fremont, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit (IC) for compensating for a package inductance is disclosed. A first ground pad is directly connected to an on-chip ground node. A second IC ground pad is connected to the on-chip ground node via a tunable capacitor circuit, where the capacitance of the tunable capacitor circuit resonates with the package inductance at the operating frequency of the IC.


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