The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2014
Filed:
Feb. 11, 2011
Applicant:
Takahiro Yurino, Yokohama, JP;
Inventor:
Takahiro Yurino, Yokohama, JP;
Assignee:
Fujitsu Semiconductor Limited, Yokohama, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device including a semiconductor element, a die pad of a plane size smaller than that of the semiconductor element, a plurality of hanging leads extending from the die pad, and sealing resin for covering the semiconductor element, the die pad, and the hanging leads. The width of a first main surface of each hanging lead, integrated with the mounting surface of the die pad, is smaller than the width of a second main surface thereof, integrated with the opposite surface of the die pad.