The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2014

Filed:

Nov. 18, 2009
Applicants:

Markus Graf, Zürich, CH;

Werner Hunziker, Stäfa, CH;

Franziska Brem, Küsnacht, CH;

Felix Mayer, Stäfa, CH;

Inventors:

Markus Graf, Zürich, CH;

Werner Hunziker, Stäfa, CH;

Franziska Brem, Küsnacht, CH;

Felix Mayer, Stäfa, CH;

Assignee:

Sensirion AG, Stafa, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); H01L 21/02 (2006.01); H01L 21/56 (2006.01); G01L 19/14 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); H01L 2924/01018 (2013.01); H01L 2224/13099 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/01006 (2013.01); G01L 19/148 (2013.01); H01L 2924/014 (2013.01); H01L 24/32 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01033 (2013.01); H01L 2224/26145 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/00013 (2013.01);
Abstract

The sensor assembly comprises a substrate (), such as a flexible printed circuit board, and a sensor chip () flip-chip mounted to the substrate (), with a first side () of the sensor chip () facing the substrate (). A sensing area () and contact pads () are integrated on the first side () of the sensor chip () and located in a chamber () between the substrate () and the sensor chip (). Chamber () is bordered along at least two sides by a dam (). Underfill () and/or solder flux is arranged between the sensor chip () and the substrate (), and the dam () prevents the underfill from entering the chamber (). An opening () extends from the chamber to the environment and is located between the substrate () and the sensor chip () or extends through the sensor chip ().


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