The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2014
Filed:
Jun. 20, 2011
Ban P. Loh, Durham, NC (US);
Nathaniel O. Cannon, Morrisville, NC (US);
Norbert Hiller, Chapel Hill, NC (US);
John Edmond, Durham, NC (US);
Mitch Jackson, Raleigh, NC (US);
Nicholas W. Medendorp, Jr., Raleigh, NC (US);
Ban P. Loh, Durham, NC (US);
Nathaniel O. Cannon, Morrisville, NC (US);
Norbert Hiller, Chapel Hill, NC (US);
John Edmond, Durham, NC (US);
Mitch Jackson, Raleigh, NC (US);
Nicholas W. Medendorp, Jr., Raleigh, NC (US);
Cree, Inc., Durham, NC (US);
Abstract
A submount for a light emitting device package includes a substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.