The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2014
Filed:
Aug. 30, 2012
Applicants:
Takashi Ohbayashi, Osaka, JP;
Seigo Shiraishi, Osaka, JP;
Inventors:
Takashi Ohbayashi, Osaka, JP;
Seigo Shiraishi, Osaka, JP;
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/52 (2010.01); H01L 33/44 (2010.01); C04B 35/628 (2006.01); C09K 11/02 (2006.01); C04B 35/632 (2006.01); C09K 11/08 (2006.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 33/501 (2013.01); C04B 35/62815 (2013.01); C04B 2235/3427 (2013.01); C09K 11/025 (2013.01); H01L 2933/0041 (2013.01); H01L 33/56 (2013.01); C04B 35/6325 (2013.01); C09K 11/08 (2013.01); C04B 35/62886 (2013.01);
Abstract
An LED encapsulation resin body disclosed in the present application includes: a phosphor; a heat resistance material arranged on, or in the vicinity of, a surface of the phosphor; and a silicone resin in which the phosphor with the heat resistance material arranged thereon is dispersed.