The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2014
Filed:
Mar. 23, 2007
Tsutomu Hiroya, Tokyo, JP;
Kouji Shigemura, Tokyo, JP;
Tsutomu Hiroya, Tokyo, JP;
Kouji Shigemura, Tokyo, JP;
NLT Technologies, Ltd., Kanagawa, JP;
Abstract
To provide a laser cutting method that is capable of cutting the substrates high accurately with high throughput at a low cost. It is a laser cutting method for cutting a laminated substrate that is formed by laminating at least a pair of substrates. The method comprises the steps of: providing a pattern member with a characteristic of absorbing light of a wavelength that transmits each of the substrates, between each of the substrates along a cutting position of the laminated substrate; and irradiating a laser of the wavelength that transmits the substrates along the pattern member, whereby the laminated substrate is cut along the pattern member.