The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2014

Filed:

Feb. 23, 2010
Applicants:

Tae Ki Hong, Gyeongbuk, KR;

Dong Guk JO, Gyeonggi-do, KR;

Han MO Koo, Gyeongbuk, KR;

Jun Young Lim, Gyeongbuk, KR;

Ki Tae Park, Gyeongbuk, KR;

Sang Ki Cho, Gyeongbuk, KR;

Dae Sung Yoo, Gyeongbuk, KR;

Nak Ho Song, Gyeongbuk, KR;

Joo Chul Kim, Gyeongbuk, KR;

Jae Sung JO, Gyeongbuk, KR;

Inventors:

Tae Ki Hong, Gyeongbuk, KR;

Dong Guk Jo, Gyeonggi-do, KR;

Han Mo Koo, Gyeongbuk, KR;

Jun Young Lim, Gyeongbuk, KR;

Ki Tae Park, Gyeongbuk, KR;

Sang Ki Cho, Gyeongbuk, KR;

Dae Sung Yoo, Gyeongbuk, KR;

Nak Ho Song, Gyeongbuk, KR;

Joo Chul Kim, Gyeongbuk, KR;

Jae Sung Jo, Gyeongbuk, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/50 (2013.01);
Abstract

The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a wiring pattern and a metal plating layer formed on a base film comprises a transfer area including a row of sprocket holes arranged along the edges of the base film at predetermined intervals, and wherein the transfer area includes an exposure area from which the base film is exposed, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.


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