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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8791214 B1

PDFFull Text
Date of Patent:
Jul. 29, 2014

Filed:

May. 25, 2012

Active ester resin, method for producing the same, thermosetting resin composition, cured product of the thermosetting resin composition, semiconductor encapsulating material, pre-preg, circuit board, and build-up film

Applicants:

Kan Takeuchi, Ichihara, JP;

Etsuko Suzuki, Ichihara, JP;

Kunihiro Morinaga, Ichihara, JP;

Kazuo Arita, Ichihara, JP;

Inventors:

Kan Takeuchi, Ichihara, JP;

Etsuko Suzuki, Ichihara, JP;

Kunihiro Morinaga, Ichihara, JP;

Kazuo Arita, Ichihara, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:

Edwards Wildman Palmer LLP

Primary Examiner:

Robert Sellers

Int. Cl.
CPC ...
B32B 15/092 (2006.01); B32B 27/04 (2006.01); C08G 8/32 (2006.01); C08L 61/14 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A low dielectric constant, a low dielectric loss tangent, and heat resistance are achieved. An active ester resin that has a resin structure produced by reacting a polyfunctional phenolic compound (a1) with a monofunctional aromatic carboxylic acid or its chloride (a2) and an aromatic dicarboxylic acid or its chloride (a3). The polyfunctional phenolic compound (a1) is represented by structural formula (1) below:

Find Patent Forward Citations

Takeuchi, Kan. (2014). Active ester resin, method for producing the same, thermosetting resin composition, cured product of the thermosetting resin composition, semiconductor encapsulating material, pre-preg, circuit board, and build-up film (U.S. Patent No. 8791214). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8791214

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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