The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2014

Filed:

Dec. 19, 2006
Applicants:

Wen Yu, Fremont, CA (US);

Stephen B. Robie, Cupertino, CA (US);

Jeremias D. Romero, Hayward, CA (US);

Inventors:

Wen Yu, Fremont, CA (US);

Stephen B. Robie, Cupertino, CA (US);

Jeremias D. Romero, Hayward, CA (US);

Assignee:

Spansion LLC, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/441 (2006.01); H01L 21/443 (2006.01); H01L 21/283 (2006.01); H01L 21/285 (2006.01); H01L 23/532 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/2855 (2013.01); H01L 21/76841 (2013.01); H01L 23/53228 (2013.01); H01L 23/53238 (2013.01);
Abstract

The present method of forming an electronic structure includes providing a tantalum base layer and depositing a layer of copper on the tantalum layer, the deposition being undertaken by physical vapor deposition with the temperature of the base layer at 50° C. or less, with the deposition taking place at a power level of 300 W or less.


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