The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2014
Filed:
Nov. 29, 2011
Applicants:
Gin Ghee Tan, Bayan Lepas, MY;
Lai Beng Teoh, Ayer Item, MY;
Royce Yeoh Kao Tziat, Bayan Lepas, MY;
Sally Yin Lye Foong, Milpitas, CA (US);
Inventors:
Gin Ghee Tan, Bayan Lepas, MY;
Lai Beng Teoh, Ayer Item, MY;
Royce Yeoh Kao Tziat, Bayan Lepas, MY;
Sally Yin Lye Foong, Milpitas, CA (US);
Assignee:
Spansion LLC, Sunnyvale, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
Wire bonds are formed at an integrated circuit device so that multiple wires are bonded to a single bond pad. In a particular embodiment, the multiple wires are bonded by first applying a stud bump to the pad and successively bonding each of the wires to the stud bump. Another stud bump can be placed over the bonded wires to provide additional connection security.