The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2014
Filed:
Apr. 08, 2010
Takahiko Kato, Hitachinaka, JP;
Takashi Naito, Funabashi, JP;
Hiroki Yamamoto, Hitachi, JP;
Takuya Aoyagi, Hitachi, JP;
Seiichi Watanabe, Sapporo, JP;
Seiji Miura, Sapporo, JP;
Norihito Sakaguchi, Sapporo, JP;
Kazuki Aoshima, Samukawa, JP;
Kenji Ohkubo, Tabetsu, JP;
Takahiko Kato, Hitachinaka, JP;
Takashi Naito, Funabashi, JP;
Hiroki Yamamoto, Hitachi, JP;
Takuya Aoyagi, Hitachi, JP;
Seiichi Watanabe, Sapporo, JP;
Seiji Miura, Sapporo, JP;
Norihito Sakaguchi, Sapporo, JP;
Kazuki Aoshima, Samukawa, JP;
Kenji Ohkubo, Tabetsu, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
An object of the present invention is to provide an electronic component using a Cu-based conductive material that can suppress oxidization even in a heat treatment in an oxidizing atmosphere and that can suppress an increase in an electrical resistance. In an electronic component having an electrode or a wiring, a ternary alloy made from three elements consisting of Cu, Al, and Co is used as a Cu-based wiring material that can prevent oxidization of the electrode or the wiring. Specifically, part or the whole of the electrode or the wiring has a chemical composition in which an Al content is 10 at % to 25 at %, a Co content is 5 at % to 20 at %, and the balance is composed of Cu and unavoidable impurities, and the chemical composition represents a ternary alloy in which two phases of a Cu solid solution formed by Al and Co being dissolved into Cu and a CoAl intermetallic compound coexist together.