The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2014

Filed:

Apr. 22, 2010
Applicants:

Jack Zezhong Peng, San Jose, CA (US);

David C. Fong, San Jose, CA (US);

Inventors:

Jack Zezhong Peng, San Jose, CA (US);

David C. Fong, San Jose, CA (US);

Assignee:

Chengdu Kiloway Electronics Inc., Chengdu, Sichuan, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and fixture using magnetic field assisted self-alignment for chip packaging. Typical embodiments include a magnetic device having one or more pole groups, each pole group including two or three poles. Some embodiments provide multiple pole groups arranged in a one or two dimensional pole group array. The poles can build up a self-alignment magnetic field. The structure of fixture is simple and easy to implement. Typical embodiments can greatly reduce chip packaging cost and make packaging more efficient. In accordance with typical embodiments, a chip and a substrate can be self-aligned magnetically regardless of their shapes.


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