The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2014
Filed:
Jul. 02, 2013
Renesas Electronics Corporation, Kawasaki, JP;
Kenji Nishikawa, Kawasaki, JP;
Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;
Abstract
A semiconductor device includes a die pad including a first surface and a second surface opposite to the first surface, a first chip arranged in a first area on the first surface, the first chip including a first side and a second side crossing to the first side, a second chip arranged in a second area on the first surface, the second chip including a third side and a fourth side crossing to the third side, a plurality of first marks formed on the first surface, the first marks including a third mark and a fourth mark, a plurality of second marks formed on the first surface, the second marks including a fifth mark and sixth mark. The semiconductor device also includes a wire and a resin encapsulating the first chip, the second chip, and the wire.