The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2014

Filed:

Nov. 04, 2011
Applicants:

Kyu-hee Han, Hwaseong-si, KR;

Byung-lyul Park, Seoul, KR;

Byunghee Kim, Seoul, KR;

Sanghoon Ahn, Gyeonggi-do, KR;

Sangdon Nam, Seoul, KR;

Kyoung-hee Kim, Incheon, KR;

Inventors:

Kyu-Hee Han, Hwaseong-si, KR;

Byung-Lyul Park, Seoul, KR;

Byunghee Kim, Seoul, KR;

Sanghoon Ahn, Gyeonggi-do, KR;

Sangdon Nam, Seoul, KR;

Kyoung-Hee Kim, Incheon, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device is provided. The semiconductor device includes a substrate having a via hole comprised of a first region having a first width and a second region having a second width greater than the first width, wherein at least a portion of the substrate is exposed in the via hole, and an insulating region having an air gap spaced apart from and surrounding the first region of the via hole.


Find Patent Forward Citations

Loading…