The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2014
Filed:
Jul. 06, 2011
Ja Myeong Koo, Suwon-si, KR;
Soon Min Hong, Seoul, KR;
Tae Sang Park, Seoul, KR;
Young Jun Moon, Hwaseong-si, KR;
Gyun Heo, Seoul, KR;
Sun Gu Yi, Yongin-si, KR;
Ja Myeong Koo, Suwon-si, KR;
Soon Min Hong, Seoul, KR;
Tae Sang Park, Seoul, KR;
Young Jun Moon, Hwaseong-si, KR;
Gyun Heo, Seoul, KR;
Sun Gu Yi, Yongin-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film adhered to the first film such that one surface of the second film contacts the first film, and an electronic circuit layer adhered to the first film. The electronic circuit layer may be arranged between the first film and the second film, wherein the first film is thermally adhered to the case. The first film may have a melting at a melting point that is lower than a heat-resistant temperature of the case.