The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2014
Filed:
Jun. 24, 2011
Xiaoming Wu, Lexington, KY (US);
Paul Dryer, Lexington, KY (US);
David Rhine, Georgetown, KY (US);
Anna Pearson, Richmond, KY (US);
Jeanne Marie Saldanha Singh, Lexington, KY (US);
Richard Wells, Westerville, OH (US);
Joel Provence, Delaware, OH (US);
Xiaoming Wu, Lexington, KY (US);
Paul Dryer, Lexington, KY (US);
David Rhine, Georgetown, KY (US);
Anna Pearson, Richmond, KY (US);
Jeanne Marie Saldanha Singh, Lexington, KY (US);
Richard Wells, Westerville, OH (US);
Joel Provence, Delaware, OH (US);
Funai Electric Co., Ltd., Osaka, JP;
Abstract
A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.