The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2014

Filed:

Jul. 30, 2012
Applicants:

Anup Bhalla, Santa Clara, CA (US);

Hamza Yilmaz, Saratoga, CA (US);

Madhur Bobde, Sunnyvale, CA (US);

Lingpeng Guan, San Jose, CA (US);

Jun HU, San Bruno, CA (US);

Jongoh Kim, Portland, OR (US);

Yongping Ding, San Jose, CA (US);

Inventors:

Anup Bhalla, Santa Clara, CA (US);

Hamza Yilmaz, Saratoga, CA (US);

Madhur Bobde, Sunnyvale, CA (US);

Lingpeng Guan, San Jose, CA (US);

Jun Hu, San Bruno, CA (US);

Jongoh Kim, Portland, OR (US);

Yongping Ding, San Jose, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor power device formed in a semiconductor substrate comprising a highly doped region near a top surface of the semiconductor substrate on top of a lightly doped region supported by a heavily doped region. The semiconductor power device further comprises source trenches opened into the highly doped region filled with conductive trench filling material in electrical contact with the source region near the top surface. The semiconductor power device further comprises buried P-regions disposed below the source trenches and doped with dopants of opposite conductivity from the highly doped region. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.


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