The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2014
Filed:
Feb. 23, 2012
Applicant:
William Wismann, Camarillo, CA (US);
Inventor:
William Wismann, Camarillo, CA (US);
Assignee:
Earthone Circuit Technologies Corporation, Carlsbad, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 18/18 (2006.01); C23C 18/22 (2006.01); H05K 3/18 (2006.01); C23C 18/16 (2006.01); H05K 3/38 (2006.01); H01L 21/288 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H05K 3/185 (2013.01); H05K 3/381 (2013.01); A05K 3/105 (2013.01); C23C 18/22 (2013.01); C23C 18/18 (2013.01); H01L 21/288 (2013.01); C23C 18/1673 (2013.01); H05K 2203/1157 (2013.01); H05K 2203/104 (2013.01); H01L 21/76838 (2013.01);
Abstract
The present invention relates to a method for forming a raised conductive image on a non-conductive or dielectric surface, the method comprising placing a metal coordination complex on a surface of the substrate, exposing the surface to electromagnetic radiation, reducing the exposed complex. removing unexposed complex leaving an elemental metal image, removing unexposed metal complex and then plating the resulting elemental metal image with a highly conductive material.