The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2014
Filed:
Aug. 02, 2011
Nicolas Garois, Amilly, FR;
Philippe Sonntag, Hericy, FR;
Grégory Martin, Villemandeur, FR;
Matthieu Vatan, Puiseaux, FR;
Jacques Drouvroy, Montargis, FR;
Nicolas Garois, Amilly, FR;
Philippe Sonntag, Hericy, FR;
Grégory Martin, Villemandeur, FR;
Matthieu Vatan, Puiseaux, FR;
Jacques Drouvroy, Montargis, FR;
Hutchinson, Paris, FR;
Abstract
The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process. A process according to the invention for preparing this thermoplastic composition in which said at least one reinforcing agent is selected from the group consisting of epoxy resins, polyorganosiloxanes having SiH functional group(s), diisocyanates or polyisocyanates and mixtures thereof, comprises a grafting, a branching and/or a crosslinking, that are carried out in situ, by reactive compounding of these phases with a shear rate greater than 10s, of said at least one reinforcing agent onto the chain of said at least one thermoplastic polymer, so that said discontinuous phase is dispersed homogeneously in said continuous phase in the form of nodules having a number-average size of less than 5 μm.