The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2014

Filed:

Feb. 17, 2012
Applicant:

Yi-tsuo Wu, Yonghe, TW;

Inventor:

Yi-Tsuo Wu, Yonghe, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present disclosure involves a lighting apparatus. The lighting apparatus includes a thermally-conductive substrate. The thermally-conductive substrate may include a substrate. The lighting apparatus also includes a printed circuit board (PCB). The PCB is located besides the thermally-conductive substrate. The PCB and the thermally-conductive substrate have different material compositions. The lighting apparatus also includes a photonic device located over the thermally-conductive substrate. The photonic device may include a light-emitting diode (LED) die. The photonic device is thermally coupled to the thermally-conductive substrate. The photonic device is electrically coupled to the printed circuit board. The lighting apparatus also includes a thermal dissipation structure. The thermal dissipation structure is thermally coupled to the thermally-conductive substrate.


Find Patent Forward Citations

Wu, Yi-Tsuo. (2014). Led packaging structure having improved thermal dissipation and mechanical strength (U.S. Patent No. 8783911). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8783911

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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