The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8781140 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 15, 2014

Filed:

Apr. 13, 2012
Applicants:

Eric J. Lautenschlager, Geneva, IL (US);

Galen Kirkpatrick, Redondo Beach, CA (US);

Inventors:

Eric J. Lautenschlager, Geneva, IL (US);

Galen Kirkpatrick, Redondo Beach, CA (US);

Assignee:

Knowles Electronics, LLC, Itasca, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A microelectromechanical (MEMS) microphone assembly includes a MEMS structure, a base portion, and a lid. The MEMS structure includes a diaphragm that responds to changes in sound pressure and the MEMS structure contributes to a vertical dimension of the assembly. The MEMS structure is supported by the base portion. The lid partially but not completely encloses the MEMS structure, such that the portion of the MEMS structure is not surrounded by the lid, the lid, and the base portion form a boundary with and are exposed to the environment external to the microphone assembly.


Find Patent Forward Citations

Lautenschlager, Eric. (2014). Compact, highly integrated microphone assembly (U.S. Patent No. 8781140). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8781140

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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