The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 15, 2014

Filed:

Oct. 18, 2011
Applicants:

Shin-ting Yen, New Taipei, TW;

Yung-chieh Chen, New Taipei, TW;

Duen-yi Ho, New Taipei, TW;

Inventors:

Shin-Ting Yen, New Taipei, TW;

Yung-Chieh Chen, New Taipei, TW;

Duen-Yi Ho, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A motherboard includes a printed circuit board (PCB), a central processing unit (CPU), a regulator, a first memory adaptor, and a second memory adaptor. The PCB includes a top surface, a bottom surface, a plurality of first soldering pads and first leads arranged on the top surface, and a plurality of second leads arranged between the top surface and the bottom surface. The PCB defines a plurality of first vias, second vias, and power vias. The CPU is connected to the first vias. The voltage regulator is connected to the power vias. The first memory adaptor neighbors to the regulator and is surface-mount soldered to the first soldering pads. The first soldering pads are connected to the first vias by first leads. The second memory adaptor is soldered to the second vias. The second vias are connected to the first vias by the second leads.


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